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Digital Packaging Conference 2018
February 6-7, 2018
Hilton San Diego Mission Valley, San Diego, California, USA
CONFERENCE FOCUS
Packaging currently makes up ~43% of the $901B commercial print market and with nearly 50% of packaging production jobs under 10,000 run length; it is clear that the future of packaging is digital, interactive and increasingly intelligent.
Chaired and led by George Gibson, Director Technology Scouting at Xerox, IMI’s Digital Packaging Conference 2018 is designed to provide comprehensive coverage of numerous factors, technologies, enablers & barriers, challenges, and most of all – Opportunities – that are combining to create Future Packaging! George will present much of the background and status based on his successful Future of Packaging course.
Many factors are driving digitization of packaging. Beverage firm's use of limited-edition, seasonal beverages alone is projected to grow by $3B from 2015 to 2017. While the market is producing increasing variety; technology is also providing increased capabilities. Higher image quality, greater substrate range, lower costs, etc. plus incorporation of new capabilities (printed electronics, sensors, taggants and much more) are making entirely new packages possible.
Packaging is becoming so much more than just the stuff the stuff comes in. Brand owners increasingly view packaging as a way to directly engage their consumers. Great new packages serve as a bridge between the consumer and the brand owner in a way previously interrupted by the distribution chain. In some of the best recent designs the package becomes a fundamental part of the value proposition for the product itself. Packaging also takes on some of the big issues of our day: enhancing consumer safety, reducing environmental impact, reducing food/materials waste, providing personalized beneficial data and much more!
The IMI Digital Packaging Conference 2018 addresses the challenges, options, and opportunities associated with future packaging requirements, technology choices, drivers & barriers, and other issues required to effectively implement packaging innovations. This strategic conference for the packaging industry provides high value information for senior executives, commercial managers, development teams and end users covering the most recent innovations, trends, and issues critical to continued growth and expansion of digital packaging applications and markets.
SPONSORS OF THE IMI DIGITAL PACKAGING CONFERENCE 2018

ADDITIONAL BENEFITS
Networking
The IMI Digital Packaging Conference 2018 gives you the opportunity to meet senior executives from within the security printing industry as well as from companies supplying security materials, using the technology or developing it for new applications. With a networking reception, a lunch and additional refreshment breaks, there is ample opportunity to meet with key people.
Over 200 registered attendees from the following companies attended one or more of IMI's Digital Print Week 2018 programs February 6-7, 2018: Inkjet Academy, Digital Packaging Conference 2018, Security Printing Conference 2018, & Understanding Inkjet Ink Conference 2018 and February 7-9, 2018: Inkjet Printing Conference 2018: Abo Akademi University, Alchemie Technology, Angstrom Technologies, Appvion, ATI Industries, Avery Dennison, Avery Dennison Digital Ink Solutions, BASF Corporation, BDT Print Media Group, Brady Corporation, Buena Vista Resources, Buhler, BYK USA, Cabot Corporation, Canon Inc, Canon Solutions America, Circle Graphics, Clariant Plastics & Coatings, CN Clark Company, Colordyne, Consultant Thomas Poe, Corning Inc., Crawford Technologies, Domtar, DuPont, Eastman Chemical, EFI, Emerson Automation Solutions, Esprix Technologies, Essilor of America, Felix Schoeller, Fujifilm Dimatix, Gem Gravure, Georgia-Pacific, Global Inkjet Systems, Global Graphic Services, Graphics Systems Services, Heidelberg, Hewlett Packard, Holoptica, Hunter Douglas Lamtec Group, ImageXpert, IIMAK, IMI, inc.jet, Integrity Industrial Ink Jet Integration, IT Strategies, Kao Collins, Korea Institute of Machinery & Materials, Landa Digital Printing, LG Electronics, Luminescence, Mack Brooks Exhibitions-InPrint USA, Mankiewicz, Mark Andy, Memjet, Michelman, NanoMatriX International, Nextflex, Nilpeter USA, OpSec Security, Pagemark Technology, Pall Microelectronics, Pivotal Resources, PPG Industries, Polestar, Printform, Procter & Gamble, Quality Engineering Associates, RadTech, Ricoh Printing Systems America, Roki S&S America, Seiko Instruments USA, SI2 Technologies, Sensient Colors, Sensor Films, SICPA, Solimar Systems, Stora Enso, Sun Chemical, Sun Chemical SA, SunJet, Technische Universität Chemnitz, Temptime Corporation, Texas Research Institute Austin, TIAX LLC, Tiger Drylac USA, Total Printing Systems, Trendvision Technology (Zhuhai), Troy Group, Univ of Northern Iowa, US Dept of State, Veritrace, VF Corporation, Work Associates, Xaar, XACTIV, Xerox, and Xpress Data.
Displays & Suppliers Forum
Digital packaging related technologies and services will be on display in the break/reception area and the Suppliers Forum enables you to hear short presentations on participating companies and their latest news.